电镀溶液中硫酸铜含量的测定 应用资料

电镀溶液中硫酸铜含量的测定 应用资料将样品加入纯水、氨水、30%硫酸和20%碘化钾后，用0.025mol/L硫代硫酸钠滴定溶液，测定硫酸铜镀液中的硫酸铜含量。终点是滴定曲线上的最大拐点。硫酸铜浓度由硫代硫酸钠的滴定体积计算得出。TIO-93023enL KM KYOTO ELECTRONICS MANUFACTURING CO.，LTD. Application Memo Copper Sulfate in Plating Solution Industry Nonferrous metal InstrumentAutomatic potentiometric titrator Measurement methodRedox t i tration StandardsHB/Z 5087.2 1.Overview Copper sulfate in copper sulfate plating solution is measured by titrat i on with 0.025mol/L sodium thiosulfate after the sample is added with pure water， ammonia water and 30% scetic acid and 20% potassium iodide. The endpoint i s the maximum inflexion on the t itration curve. The copper sulfate concentration is calculated from the titration volume of sodium thiosulfate. 2. Apparatus Main unit Automatic potentiomet r ic titrator (preamplifier STD) Electrode Plat i num electrode Ceramic reference electrode 3. Reagents Titrant 0.025mo1/L sodium thiosul f ate (f=1.004) Solvent Pure water Additive Ammonia water， 30% acetic acid， 20% potassium iodide 4. Example 340.05m -Measurement results- CoppeSrampleTitrationsulfate(mL) (mL) (g/L) 1 5.0 11.7575 9.420 140.0 o .0o 16.00ml -Titration curve- Please feel free to contact us for any further i nformation. Kyoto Electronics Manufacturing Co.， Ltd. Overseas Sales & Marketing Sect. 京都电子工业株式会社-可睦电子(上海)商贸有限公司 上海市徐汇区宜山路333号1201室 电话： 021-54488867 电邮： kemu-kem@163.com 网址： http：//www.kem-china.com