原位电学透射样品杆

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Board Contact (Type I)

This contact configuration has a conveniently removable reusable sample carrier onto which the chip is mounted.

Direct Chip Contact (Type II)

This contact configuration has a unique single chip that is directly inserted in the holder in a proprietary connector with up to 9 electrical contacts.

Spring Contact (Type III)

The spring contact configuration is a variation of the Type I connector that has fixed location spring contacts between the chip and the carrier.

Application Examples

?Correlating electrical properties of nanoscale material with microstructure ?Relating material defect populations to the electrical response Electromigration studies ?Operating microelectomechanical systems (MEMS)-based mechanical testing devices ?In-situ testing of solid-state energy devices

Options

?The 1600 Series Holder can be customized from a range of options. ?Custom designed sample carriers to fit any TEM sample geometry. ?Standard Bundled Shielded Wiring Option ?Low noise, individually shielded cabling option for pA range current measurements. ?Keithley 2400 SMU

Accessories

?Accessories available to maximize the versatility and ease of use of your Electrical Biasing Holder. ?Specialized Sample Substrate Chips ?Vacuum Tip Cover ?Custom Chip Carriers ?Keithley 2400 SMU

Nanoelectronics

Allowing researchers to perform in-situ TEM electrical measurements is a powerful tool for research into next generation of nano-scale electrical devices. Electrical signals can be applied or measured on individual nano-structures and devices, revealing relations between electrical behavior and microstructure.

Top: TEM images taken in-situ during the voltage scan in panel, at times I, II, III, and IV. Note the correlation of resistance with void size.

Bottom: Voltage scan on a single nanowires device (inset). The blue square in the inset shows the location of the TEM observation in panel B.

From Void Formation Induced Electrical Switching in Phase-Change Nanowires, Nano Letters 8, 4562, 2008. Image courtesy of Profs. Yi Cui, Stanford University and Andrew Minor, UC Berkeley.

Specification: