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当前位置: 欧兰科技 > 激光产品 > Ekspla FemtoLux30型飞秒激光器

Ekspla FemtoLux30型飞秒激光器

品牌: Ekspla
产地: 其他国家
型号: FemtoLux30
样本: 下载
报价: ¥30万 - 50万
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核心参数

组成要素: 固体激光器产品及设备

产品介绍

其它参数

基频输出波长(纳米):1030
倍频输出波长(纳米):515
1030纳米输出功率:30W
515纳米输出功率:11W
1030纳米输出能量:大于90微焦

FemtoLux 30

Industrial Femtosecond Laser
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datasheet
  • 30 W at 1030 nm, 11 W at 515 nm, 6 W at 343 nm

  • >90 µJ at 1030 nm, >55 µJ at 515 nm, >30 µJ at 343 nm

  • MHz, GHz, MHz+GHz burst modes

  • < 350 fs – 1 ps

  • Single shot to 4 MHz (AOM controlled)

  • Dry cooling (no water used)

Industrial Femtosecond Laser FemtoLux 30

Features & Applications

FEATURES

  • Typical max output power
    30 W at 1030 nm,
    11 W at 515 nm,
    6 W at 343 nm

  • >90 µJ at 1030 nm,
    >55 µJ at 515 nm,
    >30 µJ at 343 nm

  • High energy version available (1 mJ at 10 kHz)

  • MHz, GHz, MHz+GHz burst modes

  • >250 µJ in a burst mode

  • <350 fs – 1 ps

  • Single shot to 4 MHz (AOM controlled)

  • Pulse-on-demand (PoD), with jitter as low as 20 ns (peak-to-peak)

  • <0.5% RMS power long term stability over 100 hours

  • M² < 1.2

  • Beam circularity > 0.85

  • Zero maintenance

  • Dry cooling (no water used)

  • PSU and cooling unit integrated into single 4U rack housing

  • Easy and quick installation

  • Compatible with galvo and Polygon scanners as well as PSO controllers

  • 2 years of total warranty

APPLICATIONS

  • Glass, sapphire and ceramics micro processing

  • Microelectronics manufacturing

  • Glass intra volume structuring

  • Micro processing of different polymers and metals

  • LCD, LED, OLED drilling, cutting and repair

Description

A RELIABLE & VERSATILE TOOL FOR MICROMACHINING

Designed from the get-go for maximum reliability, seamless integration and non-stop 24/7/365 zero maintenance operation with innovative ”dry” cooling.

The FemtoLux 30 femtosecond laser has a tunable pulse duration from <350 fs to 1 ps and can operate in a broad AOM controlled range of pulse repetition rates from a single shot to 4 MHz.

The maximum pulse energy is more than 90 μJ operating with single pulses and can reach more than 250 µJ in burst mode, ensuring higher ablation rates and processing throughput for different materials.

The FemtoLux 30 beam parameters will meet the requirements of the most demanding materials and micro-machining applications.

Innovative laser control electronics ensure simple control of the FemtoLux 30 laser by external controllers that could run on different platforms, be it Windows, Linux or others using REST API commands.

This makes easy integration and reduces the time and human resources required to integrate this laser into any laser micromachining equipment.

SEAMLESS USER EXPERIENCE

  • Easy integration.
    Remote control using REST API commands via RS232 and LAN

  • Reduced integration time.
    Demo electronics is available for laser control programming in advance

  • Easy and quick installation.
    No water, fully disconnected laser head. Can be installed by the end-user.

  • Easy troubleshooting.
    Integrated detectors and constant system status logging.

  • No periodic maintenance required.

Innovative 'Dry' Cooling System

The FemtoLux 30 laser employs an innovative cooling system and sets new reliability standards among industrial femtosecond lasers. No additional bulky and heavy water chiller is needed.

The chiller requires periodic maintenance – cooling system draining and rinsing and water and particle filter replacement. Moreover, water leakage can cause damage to the laser head and other equipment. Instead of using water for transferring heat from a laser head, the FemtoLux 30 laser uses an innovative Direct Refrigerant Cooling method.

The refrigerant agent circulates from a PSU-integrated compressor and condenser, to a cooling plate via armored flexible lines.

The entire cooling circuit is permanently hermetically sealed and requires no maintenance.

DIRECT REFRIGERANT COOLING SYSTEM FEATURES

  • Military-grade reliability

  • Permanently hermetically sealed system >90,000 hour MTBF

  • No maintenance

  • High cooling efficiency

  • >45% lower power consumption compared to water cooling equipment

  • Compact and light

SIMPLE & RELIABLE COOLING PLATE ATTACHMENT

The cooling plate is detachable from the laser head for more convenient laser installation.

The laser cooling equipment is integrated with the laser power supply unit into a single 4U rack-mounted housing with a total weight of 15 kg.

EASY AND QUICK INSTALLATION

  • Detachable cooling plate

  • Integrated cooling equipment with the laser power supply

Specifications

ModelFemtoLux 30
MAIN SPECIFICATIONS
Central wavelength
    Fundamental1030 nm
    With second harmonic option515 nm
    With third harmonic option343 nm
Pulse Repetition Rate (PRR) 2)200 kHz – 4 MHz
Pulse repetition frequency (PRF) after frequency dividerPRF = PRR / N, N=1, 2, 3, … , 65000; single shot
Average output power
    At 1030 nm> 27 W (typical 30 W)
    At 515 nm> 11 W 3)
    At 343 nm> 6 W 3)
Pulse energy
    At 1030 nm> 90 µJ or 1 mJ 4)
    At 515 nm> 55 µJ 3)
    At 343 nm> 30 µJ 3)
Number of pulses in MHz burst 5)2 – 10
Total energy in burst mode> 250 µJ 6)
Power long term stability (Std. dev.) 7)< 0.5 %
Pulse energy stability (Std. dev.) 8)< 1 %
Pulse duration (FWHM)Tunable, < 350 fs 9) – 1 ps 10)
Beam qualityM2 < 1.2 (typical < 1.1)
Beam circularity, far field> 0.85
Beam divergence (full angle)< 1 mrad
Beam pointing thermal stability< 20 µrad/°C
Beam diameter (1/e2) at 20 cm distance from laser aperture at 1030 nm2.5 ± 0.4 mm
Triggering modeinternal / external
Pulse output controlfrequency divider, pulse picker, burst mode, packet triggering, power attenuation, pulse-on-demand 11)
Control interfacesRS232 / LAN
Length of the umbilical cord3 m, detachable
Laser head cooling typedry (direct refrigerant cooling through detachable cooling plate)
PHYSICAL CHARACTERISTICS
Laser head (W × L × H)429 × 569 × 130 mm
Power supply unit (W × L × H)449 × 376 × 177 mm
OPERATING REQUIREMENTS
Mains requirements100 – 240 V AC, single phase, 50/60 Hz
Operating ambient temperature18 – 27 °C
Relative humidity10 – 80 % (non-condensing)
Air contamination levelISO 9 (room air) or better
  1. Due to continuous improvement, all specifications are subject to change without notice. Parameters marked typical are not specifications. They are indications of typical performance and will vary with each unit we manufacture. All parameters are specified for a shortest pulse duration.

  2. When frequency divider is set to transmit every pulse. Fully controllable by integrated AOM.

  3. At 200 kHz.

  4. At 10 kHz, fixed pulse duration (for example 1 ps).

  5. Oscillator frequency ~50 MHz, ~20 ns separation between pulses.

  6. > 250 µJ in MHz burst mode or MHz+GHz burst mode at 100 kHz PRR. > 90 µJ energy in GHz burst mode.

  7. Over 100 h after warm-up under constant environmental conditions.

  8. Under constant environmental conditions.

  9. At PRR > 500 kHz. At PRR < 500 kHz shortest pulse duration is < 400 fs.

  10. Custom pulse duration by request. For example – fixed 50 fs available.

  11. Jitter < 20 ns. Trigger-to-pulse delay < 1 µs.


售后服务
保修期: 1年
是否可延长保修期:
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报修承诺: 一周内到达用户现场开始维修
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工商信息

企业名称

北京欧兰科技发展有限公司

企业信息已认证

企业类型

信用代码

110108003886158

成立日期

2002-06-14

注册资本

50000

经营范围

技术开发、技术转让、技术咨询、技术服务;计算机技术培训;基础软件服务;应用软件服务;计算机系统服务;数据处理;计算机维修;销售计算机、软件及辅助设备、电子产品、机械设备、通讯设备、五金、交电、化工产品(不含危险化学品及一类易制毒化学品)、文化用品、体育用品、日用品。(企业依法自主选择经营项目,开展经营活动;依法须经批准的项目,经相关部门批准后依批准的内容开展经营活动;不得从事本市产业政策禁止和限制类项目的经营活动。)

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