¥10万 - 20万
Heliotis
暂无样本
heliProfiler M3-XL
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欧洲
heliProfilerTM M3 / M3-XL - Efficient 3D Measurements
Progress in science and technology is often triggered by advanced measurement techniques. While there is always the possibility of guessing it right, detailed observation and in-depth analysis are indispensable for systematic and productive work. The new M3 Optical Profiler from Heliotis brings superior 3D-metrology to the professional in engineering and science. It has been designed for the most demanding applications in micromechanics, electronics, life sciences and forensics.
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Heliotis’ proprietary smart-pixel CMOS-sensor and its “parallel Optical Coherence Tomography” give the M3 an edge in terms of measurement speed and precision on almost any surfaces. The instrument has been engineered for productivity and reliability. It is manufactured in Switzerland for long lasting reliability.
Specifications for M3-XL Optical Profiler
Measuring module
3D-Sensor | Proprietary smart pixel sensor heliSenseTM S3 with in-pixel signal processing of up to 1 million 2D-slices per second |
| 2D-Camera | Live-view supports navigation on sample |
| Light source | Standard: Superluminescent Light Emitting Diode (λcenter= 800 nm, Δλ = 40 nm, Poptical = 8 mW) |
| Field of View | 0.6 x 0.6 mm (standard configuration) |
| NA | 0.4 (standard configuration) |
| Working distance | 2.8 mm (standard configuration) |
| Vertical resolution | 1 μm (standard configuration, 20 nm optional) |
| Lateral resolution | 2 μm (standard configuration) |
Scan modules
Z-axis | 20 mm vertical scan range |
| XY-table | 300 x 400 mm positioning range |
Software
Graphical User Interface | Configuration and control of the system |
| Application Programming Interface | C++, Python and LabView 8.x (scanner control, 3D-camera configuration and readout, 2D-camera configuration and readout, data processing algorithms |
Applications
Providing fast and robust 3D-metrological data, Heliotis' unique technology is capable of bringing innovations to many different fields - limited only by your imagination.
To explore what our technology can do for you, please send us a short description of your measurement task. We will gladly perform test measurements of your samples free of charge.
Electronics, Technical Surfaces
CSPs and micro-BGAs continue to increase the packaging density of PCBs, but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration, monitor process statistics for SPC and increase First Pass Yield.
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Micro-mechanics, Micro-optics
Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range, conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified.
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Life Science
The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light.
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Forensics & Security Solutions
Fnology is used for comparing cartridge cases from crime scenes, demonstrating superior performance over legacy 2D systems. Furthermore, the detailed 3D-metrology is instrumental in detecting counterfeits and forgery. |
