The Nordson DAGE 4300 bondtester complements the proven semi-automatic 4000W Wafer Handling System and has been designed in accordance with the strict standards of semiconductor foundries and subcontractors to meet the growing demand for handling and bump shear testing on 300mm wafers.
The Nordson DAGE 4300 bondtester offers similar advantages as the 4000W Wafer Handling System with regard to avoiding the manual handling of valuable wafers and increased productivity in bump testing. The 4300 bondtester:
Overcomes the need for manual handling of expensive bumped wafers
Overcomes the need for operator control of loadtool to bump alignment
Increases throughput of bump testing
Key Features
Joystick manipulation of the test head over 100% of wafer surface without repositioning the wafer on the chuck
Semi-automatic test routines for bondtesting of the entire wafer surface without repositioning the wafer on the chuck (no camera system needed). 2 reference points needed per wafer
460mm x 300mm XY stage
Wafer size 200mm or 300mm
Optional image capture system
360 degree manual chuck rotation
360 degree loadtool rotation. Automatic during auto test; manual under joystick control
Safety interlocks on wafer chuck
Frame protection for 300mm wafer
Provision for interface to customer's robot handler and other SMIF equipment
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企业名称
聚擘国际贸易(上海)有限公司
企业信息已认证
企业类型
有限责任公司(港澳台法人独资)
信用代码
91310000321628149N
成立日期
2014-12-25
注册资本
美元20.0000万
经营范围
电子产品、仪器仪表及零配件、机电产品及零配件、机械产品及零配件、化工产品及原料(危险品除外)、半导体设备、元器件及耗材的批发、进出口、佣金代理(拍卖除外)及相关配套服务(不涉及国营贸易管理商品,涉及配额、许可证管理商品的,按国家有关规定办理申请),贸易信息咨询.[依法须经批准的项目,经相关部门批准后方可开展经营活动]
聚擘国际贸易(上海)有限公司
公司地址
上海市徐汇区中山西路2020号华宜大厦1号楼1504室
客服电话